Measurement of thermal and packaging limitations in LDMOSFETs for RFIC applications

Conference Record - IEEE Instrumentation and Measurement Technology Conference

Volumn 1, Issue , 1998, Pages 160-164

  Perugupalli, P ^a   Xu, Y ^a   Shenai, K ^a  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; POWER ELECTRONICS; TEMPERATURE MEASUREMENT;

RADIO FREQUENCY TRANSISTORS;

MOSFET DEVICES;

EID: 0031703101     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)