Thermal management of high-power electronics modules packaged with interconnected parallel plates

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1998, Pages 111-119

  Haque, Shatil ^a   Xing, Kun ^a   Suchicital, Carlos ^a   Nelson, Douglas J ^a   Lu, Guo Quan ^a   Borojevic, Dusan ^a   Lee, Fred C ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; COPPER; ELECTRONICS PACKAGING; HEAT LOSSES;

METAL POSTS INTERCONNECTED PARALLEL PLATE STRUCTURES (MPIPPS); POWER ELECTRONICS BUILDING BLOCKS (PEBB); THERMAL MANAGEMENT;

POWER ELECTRONICS;

EID: 0031699067     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)