Solder joint lifetime assessment of electronic devices

International Journal for Numerical Methods in Engineering

Volumn 41, Issue 2, 1998, Pages 211-231

  Heiduschke, K ^a  

^a Alusuisse Technology and Management AG   (Switzerland)

Author keywords

Creep damage; Eutectic tin lead ( silver) solder; Large strains; Lifetime assessment; Logarithmic (or Hencky) strain space description; Mechanical reliability; Strain rate dependent constitutive (evolution) equations

Indexed keywords

COMPUTER SIMULATION; CREEP; RELIABILITY; STRAIN RATE; STRESSES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

CREEP DAMAGE; EUTECTIC TIN LEAD SILVER SOLDER; LIFETIME ASSESSMENT;

FINITE ELEMENT METHOD;

EID: 0031696765     PISSN: 00295981     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-0207(19980130)41:2<211::AID-NME265>3.0.CO;2-A     Document Type: Article

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