Thermodynamics of a Stable Blister Delamination at Elevated Temperature

Journal of Adhesion

Volumn 66, Issue 1-4, 1998, Pages 183-202

  Wan, Kai Tak ^a   Breach, Christopher D ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Adhesion; Blister test; Delamination; Fracture mechanics; TMA

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); DISSIMILAR MATERIALS; ELASTICITY; FRACTURE MECHANICS; HIGH TEMPERATURE PROPERTIES; OPTICAL MICROSCOPY; PLASTIC COATINGS; THERMAL EFFECTS; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES;

BLISTER TESTS; THERMOMECHANICAL ANALYSIS;

DELAMINATION;

EID: 0031681874     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469808009965     Document Type: Article

References (23)

1. Lau, J. H., Thermal stress and strain in microelectronics packaging (Van Nostrand Reinhold, NY, 1993).
2. Matienzo, L. J. and Egitto, F. D., Solid State Tech. 7, 99 (1995).
3. Thouless, M. D. and Jensen, H. M., J. Adhesion 38, 185 (1992).
4. Williams, M. L., J. Appl. Polym. Sci. 13, 29 (1969).
5. Hinkley, J. A., J. Adhesion 16, 115 (1983).
6. Gent, A. N. and Lewandowski, L. H., J. Appl. Polym. Sci. 33, 1567 (1987).
7. Fernando, M. and Kinloch, A. J., Int. J. Adhesion Adhesives 10, 69 (1990).
8. Briscoe, B. J. and Panesar, S. S., Proc. R. Soc. Lond. A 433, 23 (1991).
9. Chu, Y. Z. and Durning, C. J., J. Appl. Polym. Sci. 45, 1151 (1992).
10. Malyshev, B. M. and Salganik, R. L., Int. J. of Fracture Mechanics 1, 114 (1965).
11. Wan, K.-T. and Mai, Y.-W., Int. J. Fracture 74, 181 (1995).
12. Allen, M. G. and Senturia, S. D., J. Adhesion 25, 303 (1988).
13. Allen, M. G. and Senturia, S. D., J. Adhesion 29, 219 (1989).
14. Dillard, D. A. and Bao, Y., J. Adhesion 33, 253 (1991).
15. Chang, Y.-S., Lai, Y.-H. and Dillard, D. A., J. Adhesion 27, 197 (1989).
16. Lai, Y.-H. and Dillard, D. A., J. Adhesion 31, 177 (1990).
17. Lai, Y.-H. and Dillard, D. A., J. Adhesion 33, 63 (1990).
18. Wan, K.-T. and Mai, Y.-W., Acta Metall. Mater. 43, 4109 (1995).
19. Hencky, H., Math. Phys. 63, 311 (1915).
20. Williams, J. G., Fracture Mechanics of Polymers (John Wiley and Sons, NY, 1984).
21. Williams, J. G., Int. J. Fracture, to be published in 1997.
22. Wan, K.-T., in preparation.
23. Wan, K.-T., Horn, R. G., Courmont, S. and Lawn, B. R., J. Mater. Res. 8, 1128 (1993).