Strength distribution changes in a silicon nitride as a function of stressing rate and temperature

American Society of Mechanical Engineers (Paper)

Volumn , Issue GT, 1998, Pages

  Wereszczak, Andrew A ^a   Breder, Kristin ^a   Andrews, Mark J ^a   Kirkland, Timothy P ^a   Ferber, Mattison K ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; CRACK PROPAGATION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; PROBABILITY; RESIDUAL STRESSES; THERMAL EFFECTS; WEIBULL DISTRIBUTION;

EXHAUST VALVES;

SILICON NITRIDE;

EID: 0031681076     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)