Overlay multichip module packaging for high performance MEMS instruments

Instrumentation in the Aerospace Industry : Proceedings of the International Symposium

Volumn 44, Issue , 1998, Pages 219-228

  Butler, Jeffrey T ^a   Comtois, John H ^a   Bright, Victor M ^a  

^a AIR FORCE INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; LASER ABLATION; MICROELECTRONICS; MULTICHIP MODULES;

HIGH DENSITY INTERCONNECT (HDI);

MICROELECTROMECHANICAL DEVICES;

EID: 0031678132     PISSN: 02277576     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)