Single-chip condenser microphone using porous silicon as sacrificial layer for the air gap

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 591-596

  Kronast, W ^a   Mueller, B ^a   Siedel, W ^a   Stoffel, A ^a  

^a FURTWANGEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; MICROELECTRODES; MICROELECTROMECHANICAL DEVICES; POROUS MATERIALS; SENSITIVITY ANALYSIS; SILICON WAFERS; TENSILE STRENGTH;

SACRIFICIAL LAYER; SILICON NITRIDE MEMBRANES; SINGLE CHIP CONDENSER MICROPHONES;

MICROPHONES;

EID: 0031677507     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)