Fully packaged CMOS current monitor using lead-on-chip technology

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 603-608

  Steiner, R ^a   Schneider, M ^a   Mayer, F ^a   Munch, U ^a   Mayer, M ^a   Baltes, H ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS;

AUTOMATIC MASS PACKAGING; LEAD ON CHIP PACKAGING;

CMOS INTEGRATED CIRCUITS;

EID: 0031654968     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)