Plastic packaging of optical modules for the access network system applications

Conference on Optical Fiber Communication, Technical Digest Series

Volumn 1998-January, Issue , 1998, Pages 346-347

  Tatsuno, Kimio ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; LSI CIRCUITS; OPTICAL COATINGS; OPTOELECTRONIC DEVICES; RELIABILITY; SEMICONDUCTING SILICON; SILICONE COATINGS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL CONDUCTIVITY OF SOLIDS; TRANSMITTERS;

MINI DUAL IN LINE (MINIDIL); PLASTIC PACKAGINGS;

ELECTRONICS PACKAGING;

EID: 0031650990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. S. Turley R. Baker, J. Leach, T. Bricheno, I. Woods D. Spear, N. Lambert, J. Severn, R. Simpson, R. Buckley, in OECC'96 Technical Digest, 1996, paper 18D3-4. p. 408.
2. J. Yoshida, in Optical Fiber Communication Conference, Vol. 6 of 1997 OSA Technical Digest Series (Optical Society of America, Washington, D.C., 1997), p. 275.
3. K. Tatsuno, T. Kato, T. Hirataka, K. Yoshida, T. Ishii, T. Kono, T. Miura, R. Sudo, M. Shimaoka, in Optical Fiber Communication Conference, Vol. 6 of 1997 OSA Technical Digest Series (Optical Society of America, Washington, D.C., 1997), p. 11 1.
4. K. Otsuka, Y. Takeo, H. Ishida, T. Yamada, S. Kuroda, H. Tachi, IEEE Trans. on CHMT CHMT-12, (December 1987).
5. M. Shishikura, S. Tanaka, H. Nakamura, Y. Matsuoka, S. Kikuchi, K. Nagatsuma, R. Sudo, T. Miura, T. Ono, S. Tsuji, presented at ECOC'97, Edinburgh, United Kingdom, September 1997.