Characterizing the thermal performance of a flow through electronics module (SEM-E format) using a porous media model

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1998, Pages 68-77

  Tang, L ^a   Moores, K A ^a   Ramaswamy, C ^a   Joshi, Y ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COUPLINGS; FINS (HEAT EXCHANGE); HEAT TRANSFER; MATHEMATICAL MODELS; POROUS MATERIALS; PRESSURE DROP; TEMPERATURE MEASUREMENT; THERMAL LOAD;

BRINKMAN-FORCHHEIMER EXTENDED DARCY POROUS MEDIA;

ELECTRONICS PACKAGING;

EID: 0031649315     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)