Fabrication and mechanical properties of 5 vol% copper dispersed alumina nanocomposite

Journal of the European Ceramic Society

Volumn 18, Issue 1, 1998, Pages 31-37

  Oh, Sung Tag ^a,b   Sekino, Tohru ^a   Niihara, Koichi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Synergy Ceramics Lab   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COPPER; CRYSTAL MICROSTRUCTURE; DISPERSIONS; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; HOT PRESSING; REDUCTION; RESIDUAL STRESSES; SINTERING; THERMAL STRESS; TOUGHENING;

CRACK BRIDGING MODEL;

CERMETS;

EID: 0031647304     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0955-2219(97)00099-x     Document Type: Article

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