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Volumn 47, Issue 1, 1998, Pages 125-128

A dependable high performance wafer scale architecture for embedded signal processing

Author keywords

Computer reliability; Embedded processing; High speed integrated circuits; Memory hierarchies; Parallel architectures; Wafer scale integration

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER ARCHITECTURE; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; MULTICHIP MODULES; RANDOM ACCESS STORAGE; RELIABILITY; SIGNAL PROCESSING; WSI CIRCUITS;

EID: 0031647075     PISSN: 00189340     EISSN: None     Source Type: Journal    
DOI: 10.1109/12.656096     Document Type: Article
Times cited : (6)

References (13)
  • 4
    • 84865934645 scopus 로고    scopus 로고
    • "Density Improvement for Planar Hybrid Wafer Scale Integration," U.S. Patent 5,432,681, July 11, 1995
    • R.W. Linderman, "Density Improvement for Planar Hybrid Wafer Scale Integration," U.S. Patent 5,432,681, July 11, 1995.
    • Linderman, R.W.1
  • 6
    • 0030709744 scopus 로고    scopus 로고
    • Real-Time STAP Demonstration on an Embedded High Performance Computer
    • M. Linderman and R. Linderman, "Real-Time STAP Demonstration on an Embedded High Performance Computer," Proc. 1997 IEEE Nat'l Radar Conf., pp. 54-59, 1997.
    • (1997) Proc. 1997 IEEE Nat'l Radar Conf. , pp. 54-59
    • Linderman, M.1    Linderman, R.2
  • 7
    • 33747432015 scopus 로고    scopus 로고
    • D.K. Pradhan, ed., Prentice Hall
    • Fault Tolerant Computing, D.K. Pradhan, ed., pp. 455-460. Prentice Hall, 1996.
    • (1996) Fault Tolerant Computing , pp. 455-460
  • 9
    • 0026732523 scopus 로고
    • The 3D Stack in Short Form
    • J.A. Minahan et al., "The 3D Stack in Short Form," Proc. ECTC, pp. 340-344, 1992.
    • (1992) Proc. ECTC , pp. 340-344
    • Minahan, J.A.1
  • 10
    • 0025901414 scopus 로고
    • A New Approach to Implement a Defect Tolerant Power Distribution Network in WSI Circuit
    • Jan.
    • M.W. Yung and M.J. Little, "A New Approach to Implement a Defect Tolerant Power Distribution Network in WSI Circuit," Proc. 1991 Int'l Conf. Wafer Scale Integration, pp. 215-222, Jan. 1991.
    • (1991) Proc. 1991 Int'l Conf. Wafer Scale Integration , pp. 215-222
    • Yung, M.W.1    Little, M.J.2
  • 11
    • 0025901414 scopus 로고
    • A New Approach to Implement a Defect Tolerant Power Distribution Network in WSI Circuit
    • Jan.
    • M.W. Yung and M.J. Little, "A New Approach to Implement a Defect Tolerant Power Distribution Network in WSI Circuit," Proc. 1991 Int'l Conf. Wafer Scale Integration, pp. 215-222, Jan. 1991.
    • (1991) Proc. 1991 Int'l Conf. Wafer Scale Integration , pp. 215-222
    • Yung, M.W.1    Little, M.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.