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Volumn 56, Issue 1, 1998, Pages 36-42
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Electronic speckle pattern interferometry applied to the characterization of materials at elevated temperature
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONIC SPECKLE PATTERN INTERFEROMETRY;
ELEVATED TEMPERATURE;
SPECKLE;
HOLOGRAPHIC INTERFEROMETRY;
DEFORMATION;
HIGH TEMPERATURE TESTING;
MATERIALS TESTING;
NONDESTRUCTIVE EXAMINATION;
SPECKLE;
STRAIN;
ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI);
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EID: 0031646778
PISSN: 00255327
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
Times cited : (2)
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References (9)
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