Interconnect scaling: Signal integrity and performance in future high-speed CMOS designs

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1998, Pages 42-43

  Sylvester, Dennis ^a   Hu, Chenming ^a   Nakagawa, O Sam ^a   Oh, Soo Young ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COPPER; CROSSTALK; DIELECTRIC MATERIALS; INTEGRATED CIRCUIT LAYOUT; ULSI CIRCUITS;

INTERCONNECT SCALING;

CMOS INTEGRATED CIRCUITS;

EID: 0031645246     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)