|
|
|
Volumn 2, Issue , 1998, Pages 1099-1102
|
|
Thermal benefits of diamond enhanced plastic packages for microwave applications
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
HEAT LOSSES;
MICROWAVE DEVICES;
MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;
SEMICONDUCTING DIAMONDS;
SEMICONDUCTING GALLIUM ARSENIDE;
DIAMOND ENHANCED PLASTIC PACKAGES;
POWER AMPLIFIERS;
|
|
EID: 0031643559
PISSN: 0149645X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (2)
|
|
References (1)
|
