18 GHz Si bipolar mold package prescaler

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1998, Pages 213-216

  Mineo, Masaho ^a   Okamoto, Mariko ^a   Hosoki, Kimio ^a   Ohba, Hideo ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT OSCILLATIONS; ELECTRONICS PACKAGING; ENERGY DISSIPATION; INTEGRATED CIRCUIT LAYOUT; MASKS; SEMICONDUCTING SILICON;

MOLD PACKAGE STATIC PRESCALERS;

BIPOLAR TRANSISTORS;

EID: 0031643531     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)