Effects of residual stress on modulus measurements by indentation

Materials Research Society Symposium - Proceedings

Volumn 505, Issue , 1998, Pages 85-90

  Bahr, D F ^a   Crowson, D A ^a   Robach, J S ^a   Gerberich, W W ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; FILM PREPARATION; GLASS; HARDNESS TESTING; MECHANICAL VARIABLES MEASUREMENT; PLATINUM; RESIDUAL STRESSES; SILICON; SPUTTER DEPOSITION; STRESS ANALYSIS; SUBSTRATES;

CONTINUOUS INDENTATION TECHNIQUES; MODULUS MEASUREMENTS;

METALLIC FILMS;

EID: 0031643228     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)