Void-effect modeling of flip-chip encapsulation on ceramic substrate

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 251-255

  Niu, Tyan Min ^a   Sammakia, Bahgat ^a   Sathe, Sanjeev ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; SOLDERING; STRAIN; STRESSES; SUBSTRATES; THERMAL CYCLING;

SOLDER BUMPS; UNDERFILL; VOIDS;

FLIP CHIP DEVICES;

EID: 0031642324     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)