Application of dielectric analysis to the study of ageing in adhesive bonded structures

Materials Research Society Symposium - Proceedings

Volumn 503, Issue , 1998, Pages 69-74

  Pethrick, Richard A ^a   Joshi, Sadanand B ^a   Hayward, David ^a   Li, Zhi Cheng ^a   Halliday, Steven ^a   Banks, William M ^a   Gilmore, Ray ^a   Yates, Lawrence W ^a  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALUMINUM; DIELECTRIC RELAXATION; HYDRATION; MOLECULAR DYNAMICS; PLASTIC ADHESIVES; WATER ABSORPTION;

DIPOLE MOBILITY;

ADHESIVE JOINTS;

EID: 0031640942     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)