The influence of addition elements on the early resistance changes observed during electromigration testing of A1 metal lines

Microelectronics Reliability

Volumn 38, Issue 1, 1998, Pages 87-98

  De Ceuninck, W A ^a,b   D'Haeger, V ^a   Van Olmen, J ^a   Witvrouw, A ^c   Maex, K ^c   De Schepper, L ^a,b   De Pauw, P ^d   Pergoot, A ^d  

^a HASSELT UNIVERSITY   (Belgium)

^b DESTIN NV   (Belgium)

^c IMEC   (Belgium)

^d LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ANNEALING; ELECTRIC RESISTANCE MEASUREMENT; METAL TESTING; METALLIZING;

CURRENT STRESS;

ELECTROMIGRATION;

EID: 0031640124     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00064-4     Document Type: Article

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