Quantitative measurement of the effect of annealing on the adhesion of thin copper films using superlayers

Materials Research Society Symposium - Proceedings

Volumn 505, Issue , 1998, Pages 363-368

  Kriese, M D ^a   Moody, N R ^a   Gerberich, W W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; COPPER; DELAMINATION; FRACTURE; SILICA; SILICON WAFERS; THIN FILMS;

NANOINDENTATION; SUPERLAYERS;

METALLIC FILMS;

EID: 0031634621     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)