Under bump metallization development for eutectic Pb-Sn solders

Materials Research Society Symposium - Proceedings

Volumn 515, Issue , 1998, Pages 73-77

  Hong, S J ^a   Korhonen, T M ^a   Korhonen, M A ^a   Li, C Y ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPOSITE MICROMECHANICS; COPPER ALLOYS; EUTECTICS; LEAD ALLOYS; METALLIZING; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS;

MICROMECHANICAL SHEAR TESTING; UNDER BUMP METALLIZATION (UBM);

ELECTRONICS PACKAGING;

EID: 0031632322     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-515-73     Document Type: Conference Paper

References (6)