Study of the effects of BGA solder geometry on fatigue life and reliability assessment

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 229-232

  Yu, Qiang ^a   Shiratori, Masaki ^a   Ohshima, Yoichi ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MECHANICAL TESTING; NUMERICAL ANALYSIS; PARAMETER ESTIMATION; RELIABILITY; SOLDERED JOINTS; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL;

MANSON-COFFIN LAW; RELIABILITY ASSESSMENT; SHEAR FATIGUE TEST;

ELECTRONICS PACKAGING;

EID: 0031630741     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)