Alternative placement systems for three-dimensional circuit boards

CIRP Annals - Manufacturing Technology

Volumn 47, Issue 1, 1998, Pages

  Feldmann, K ^a   Krimi, S ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Assembly; Flexible Manufacturing; Robotic

Indexed keywords

COMPUTER SIMULATION; ERROR COMPENSATION; FLEXIBLE MANUFACTURING SYSTEMS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SURFACE MOUNT TECHNOLOGY;

CARTESIAN PLACEMENT SYSTEM; MOLDED INTERCONNECT DEVICE TECHNOLOGY (MID); THREE DIMENSIONAL CIRCUIT BOARDS;

ROBOTIC ASSEMBLY;

EID: 0031630379     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0007-8506(07)62777-2     Document Type: Article

References (11)

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