High performance packaging technique used for clamped gain semiconductor optical amplifier array modules fabrication

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1270-1273

  Grard, E ^a   Le Bris, J ^a   Di Maggio, M ^a   Dorgeuille, F ^a   Emery, J Y ^a   Bonno, P ^a   Renaud, M ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FABRICATION; NETWORK COMPONENTS; OPTICAL SWITCHES; YTTRIUM ALUMINUM GARNET; ELECTRONICS PACKAGING; LASER BEAM WELDING; OPTICAL FIBERS; OPTICAL INTERCONNECTS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLID STATE LASERS;

COLLECTIVE PROCESS; DYNAMIC ALIGNMENT; HIGH-PERFORMANCE PACKAGING; PACKAGING TECHNIQUES; PIGTAILING; YAG LASER WELDING;

SEMICONDUCTOR OPTICAL AMPLIFIERS; SEMICONDUCTOR LASERS;

MULTIWAVELENGTH OPTICAL CROSS CONNECT MODES;

EID: 0031626177     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678903     Document Type: Conference Paper

References (7)

1. Jourdan, A., et al, J. Lightwave Technol., Vol. 14, N° 6, pp. 1198-1206, June 1996
2. Emery, J-Y., et al, El. letter, V33, n°12, ppl083-1084, 1997
3. Emery, J-Y., et al, OAA'97, paper Tu C2, Victoria BC, Canada, 1997
4. Grard, E., et al, LEOS 94, paper OP 1. 2, Boston, 1994
5. Le Bris, J., et al, ECOC'96, paper Th C. 2. 3, Oslo, 1996
6. Jourdan, A., et al, ECOC'97, paper Wei D. l, Edinburgh, 1997
7. Bachmann, M., et al, El. lett, Vol. 32, N°22, pp 2076-2078, October 1996.