Packaging aspects of the Jitney parallel optical interconnect

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1206-1215

  Cohen, M S ^a   Johnson, G W ^a   Kuchta, D M ^a   Pepeljugoski, P K ^a   Trewhella, J W ^a   Ouimet, S E ^b   Spanoudis, S L ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM CANADA LTD   (Canada)

^c LEXMARK INTERNATIONAL INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NETWORK COMPONENTS; ALIGNMENT; DATA COMMUNICATION SYSTEMS; ELECTRONICS PACKAGING; OPTICAL LINKS; PLASTIC PARTS;

AT-SPEED; LEAD-FRAME; LOW COSTS; MOLDED PARTS; OPTICAL ALIGNMENTS; OPTICAL INTERCONNECT;

OPTICAL INTERCONNECTS;

DATA LINKS; JITNEY PARALLEL OPTICAL INTERCONNECTS;

EID: 0031625557     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678877     Document Type: Conference Paper

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