A new nonepoxy liquid die attach adhesive

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1402-1406

  Rosenfeld, J ^a   Rojstaczer, S ^a   Xu, Mingzhu ^a   McCollum, P ^a  

^a Occidental Chemical Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CURING; ELECTRONICS PACKAGING; MICROELECTRONICS; NETWORK COMPONENTS; BOND STRENGTH (MATERIALS); POLYIMIDES;

ADHESIVE SYSTEMS; ADHESIVE TECHNOLOGY; DIE ATTACH ADHESIVE; EPOXY MOLDING COMPOUNDS; PLASTIC PACKAGES; POST-CURING; SOLVENTLESS; UNREACTED MONOMERS;

ADHESIVES; PLASTIC ADHESIVES;

IMIDE ADHESIVES; LIQUID DIE ATTACH ADHESIVES;

EID: 0031625546     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678927     Document Type: Conference Paper

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