Cooling performance of heat sinks with corrugated-fins

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 104-111

  Tasaka, Masahito ^a   Shinohara, Kenjiro ^a   Hayashi, Chihiro ^a   Kashima, Shoichi ^a   Koyama, Ken ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DUCTS; EQUIPMENT TESTING; FINS (HEAT EXCHANGE); FLOW OF FLUIDS; FORCED CONVECTION; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; LSI CIRCUITS; NUSSELT NUMBER; PERFORMANCE; PRESSURE DROP;

CORRUGATED FINS; FORCE AIR CONVECTION;

HEAT SINKS;

EID: 0031625138     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)