Least-material optimization of vertical pin-fin, plate-fin, and triangular-fin heat sinks in natural convective heat transfer

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 295-302

  Iyengar, Madhusudan ^a   Bar Cohen, Avram ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT LOSSES; HEAT TRANSFER COEFFICIENTS; LAMINAR FLOW; NATURAL CONVECTION; NUSSELT NUMBER; OPTIMIZATION;

TRIANGULAR PLATE FINS; VERTICAL FIN ARRAYS;

FINS (HEAT EXCHANGE);

EID: 0031624687     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)