Solder joint fatigue life of fleXBGATM assemblies

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 707-712

  Darveaux, R ^a   Mawer, A ^b  

^a Amkor Electronics   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; NETWORK COMPONENTS; SOLDERING ALLOYS; INTEGRATED CIRCUIT MANUFACTURE; SUBSTRATES;

BOARD-LEVEL RELIABILITY; FLEX CIRCUITS; SOLDER JOINT FATIGUE;

FATIGUE OF MATERIALS; ELECTRONICS PACKAGING;

BALL GRID ARRAYS (BGA); FLEX CIRCUIT SUBSTRATES;

EID: 0031624420     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678776     Document Type: Conference Paper

References (9)

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