|
Volumn 12, Issue 11, 1998, Pages 1219-1242
|
Cracking and loss of adhesion of Si3N4 and SiO2:P films deposited on Al substrates
|
Author keywords
Adhesion; Buckling; Cracking; Debonding; Fracture energy; Mechanical stability; Thin films
|
Indexed keywords
ADHESION;
ALLOYING ELEMENTS;
ALUMINUM;
CRACK INITIATION;
FILMS;
PHOSPHORUS;
SILICA;
SUBSTRATES;
BUCKLING;
CRACKS;
DEBONDING;
FRACTURE ENERGY;
MECHANICAL STABILITY;
SCANNING ELECTRON MICROSCOPY;
SILICON;
SILICON COMPOUNDS;
STRAIN;
TENSILE TESTING;
THIN FILMS;
DEBONDING;
SILICON NITRIDE;
ADHESION;
AL SUBSTRATE;
CRACK DENSITY;
CRACK DEVELOPMENT;
CRITICAL STRAINS;
DEADHESION;
INTERFACIAL FRACTURE ENERGY;
INTERFACIAL STRENGTH;
LONGITUDINAL STRAIN;
MULTIPLE FILMS;
SCANNING ELECTRON MICROSCOPE;
TENSILE TESTS;
THROUGH-THICKNESS CRACKING;
|
EID: 0031624290
PISSN: 01694243
EISSN: 15685616
Source Type: Journal
DOI: 10.1163/156856198X00407 Document Type: Article |
Times cited : (33)
|
References (36)
|