메뉴 건너뛰기




Volumn 12, Issue 11, 1998, Pages 1219-1242

Cracking and loss of adhesion of Si3N4 and SiO2:P films deposited on Al substrates

Author keywords

Adhesion; Buckling; Cracking; Debonding; Fracture energy; Mechanical stability; Thin films

Indexed keywords

ADHESION; ALLOYING ELEMENTS; ALUMINUM; CRACK INITIATION; FILMS; PHOSPHORUS; SILICA; SUBSTRATES; BUCKLING; CRACKS; DEBONDING; FRACTURE ENERGY; MECHANICAL STABILITY; SCANNING ELECTRON MICROSCOPY; SILICON; SILICON COMPOUNDS; STRAIN; TENSILE TESTING; THIN FILMS;

EID: 0031624290     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856198X00407     Document Type: Article
Times cited : (33)

References (36)
  • 1
  • 2
    • 5244318650 scopus 로고
    • C. Li, P. Totta and P. Ho (Eds), AIP Conf. Proc, New York
    • P. A. Flinn, in: Stress-induced Phenomena in Metallization, C. Li, P. Totta and P. Ho (Eds), AIP Conf. Proc., Vol. 263, pp. 73-79. New York (1992)
    • (1992) Stress-Induced Phenomena in Metallization , vol.263 , pp. 73-79
    • Flinn, P.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.