The influence of the variation of the coefficient of thermal expansion with temperature on the microcracking behavior of K3B/IM7 and X5260/G40-800 composites

Composites Part B: Engineering

Volumn 29, Issue 4, 1998, Pages 391-396

  Huang, Xiaogang ^a   Eduljee, Rushad F ^a   Gillespie Jr , John W ^a  

^a UNIVERSITY OF DELAWARE   (United States)

Author keywords

Energy release rate; Matrix cracking; Temperature dependent CTE; Thermal residual stress

Indexed keywords

COMPUTATIONAL METHODS; FINITE ELEMENT METHOD; MECHANICAL PROPERTIES; MICROCRACKING; RESIDUAL STRESSES; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS; THERMAL VARIABLES MEASUREMENT;

ENERGY RELEASE RATE; THERMAL EXPANSION COEFFICIENTS;

LAMINATED COMPOSITES;

EID: 0031623094     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-8368(97)00048-6     Document Type: Article

References (7)

1. Gillespie, Jr., J. W., Huang, X., Hansen. U, Modeling approach for the effect of temperature on the long term performance of composites. Center for Composite Materials Technical Report, University of Delaware, 1991.
2. Carlsson, L. A., Pipes, R. B., Experimental Characterization of Advanced Composite Materials. Prentice-Hall, Inc., Englewood Cliffs, NJ, 1987.
3. Du Pont Company, Fibers Department, Properties and Characteristics of Avimid K Composite Materials, 1990.
4. Wang, A.S.D., Chou, P.C. and Lei, S., A stochastic model for the growth of matrix cracks in composite laminates. Journal of Composite Materials, 1984, 18, 239-254.
5. Kanninen, M. F., Popelar, C. H., Advanced Fracture Mechanics. New York, Oxford University Press; Oxford, Clarendon Press, 1985, pp. 159-163.
6. Lei, S., Wang, A. S. D., A comprehensive study on damage tolerance properties of notched composite laminates. Drexel University Annual Scientific Report, September 1985.
7. Huang, X., Gillespie, Jr., J. W., Eduljee, R. F., Fracture test and prediction of high speed civil transport composite materials. Proceedings of the American Society for Composites Eighth Technical Conference, 1993.