Effect of solution composition in nickel electrodeposition on silicon surfaces

Metal Finishing

Volumn 96, Issue 1, 1998, Pages 49-51

  Gomes, C R ^a   Kieling, V C ^a  

^a FEDERAL UNIVERSITY OF RIO GRANDE DO SUL   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CURRENT DENSITY; CYCLIC VOLTAMMETRY; ELECTRIC VARIABLES CONTROL; MORPHOLOGY; NICKEL PLATING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SOLUTIONS; SURFACES; THIN FILMS;

NICKEL BATH; NICKEL ELECTROPLATING;

ELECTROPLATING;

EID: 0031621639     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(97)80244-9     Document Type: Article

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