Polymer-based, low-cost integrated substrates for power electronics

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 43, Issue 1, 1998, Pages 517-527

  Kowbel, W ^a   Xia, X ^a   Withers, J C ^a  

^a Research Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON CARBON COMPOSITES; COST EFFECTIVENESS; ELECTRONICS PACKAGING; POWER ELECTRONICS; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

DIELECTRIC INSULATION;

THERMAL INSULATING MATERIALS;

EID: 0031621134     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)