Novel, matched CTE integrated substrates for power electronics

Materials Research Society Symposium - Proceedings

Volumn 515, Issue , 1998, Pages 141-146

  Kowbel, W ^a   Xia, X ^a   Bruce, C ^a   Withers, J C ^a  

^a MER CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON CARBON COMPOSITES; COATINGS; DIELECTRIC MATERIALS; METALLIZING; POWER ELECTRONICS; SILICON CARBIDE; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

CHIP-ON-BOARD (COB) TECHNOLOGY; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 0031619237     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-515-141     Document Type: Conference Paper

References (3)