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Volumn , Issue , 1998, Pages 155-158
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New optimization strategy for CMOS device process in the era of 0.2 μm and beyond for MPU's and ASIC's
a a a a
a
HITACHI LTD
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
ELECTRIC POTENTIAL;
ELECTRIC WIRING;
HEAT RESISTANCE;
INTEGRATED CIRCUIT MANUFACTURE;
WIRE;
THERMAL RUNAWAY;
WIRING CHANNEL DENSITY;
CMOS INTEGRATED CIRCUITS;
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EID: 0031617881
PISSN: 08865930
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (3)
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