Model high-performance adhesive systems

Journal of Applied Polymer Science

Volumn 66, Issue 10, 1997, Pages 1953-1963

  Klug, Jeremy H ^a   Seferis, James C ^a  

^a UNIVERSITY OF WASHINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FRACTURE TOUGHNESS; MOLECULAR STRUCTURE; MORPHOLOGY; OPTICAL MICROSCOPY; PHASE COMPOSITION; RUBBER; THERMOANALYSIS;

DYNAMIC MECHANICAL ANALYSIS;

PLASTIC ADHESIVES;

EID: 0031555264     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19971205)66:10<1953::AID-APP11>3.0.CO;2-W     Document Type: Article

References (37)