Interface structure between polyimide film substrate and copper film prepared by ion beam and vapor deposition (IVD) method

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 121, Issue 1-4, 1997, Pages 207-211

  Ebe, Akinori ^a   Takahashi, Eiji ^a   Kuratani, Naoto ^a   Nishiyama, Satoshi ^a   Imai, Osamu ^a   Ogata, Kiyoshi ^a   Setsuhara, Yuichi ^b   Miyake, Shoji ^b  

^a NISSIN ELECTRIC CO LTD   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ARGON; EVAPORATION; FILMS; INTERFACES (MATERIALS); ION BEAMS; ION BOMBARDMENT; POLYIMIDES; SUBSTRATES; VAPOR DEPOSITION;

ION BEAM EFFECTS;

COPPER;

EID: 0031546209     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-583X(96)00697-0     Document Type: Article

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