TEM investigation of the stainless steel/aluminum interface created by the surface activated bonding method

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 121, Issue 1-4, 1997, Pages 519-523

  Yang, Liu ^a,b   Hosoda, Naoe ^a   Suga, Tadatama ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b SOUTHWEST JIAOTONG UNIVERSITY   (China)

Author keywords

Aluminum; Electron microscopy; Interface; Stainless steel; Surface activated bonding

Indexed keywords

ALUMINUM; BONDING; IMPURITIES; INTERFACES (MATERIALS); MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

SURFACE ACTIVATED BONDING;

STAINLESS STEEL;

EID: 0031546162     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-583X(96)00446-6     Document Type: Article

References (7)

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