Prediction of solder geometry for an axisymmetric through-hole joint

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 268-274

  Elkouh, A F ^a   Ramasubramanian, N ^a   Shangguan, D ^c   Nigro, N J ^a   Heinrich, S M ^a   Lee, P S ^b  

^a MARQUETTE UNIVERSITY   (United States)

^b ROCKWELL AUTOMATION   (United States)

^c FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL EQUATIONS; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS;

SOLDER GEOMETRY; THROUGH HOLE JOINTS;

SOLDERED JOINTS;

EID: 0031386070     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792248     Document Type: Article

References (6)

1. Chu, T. Y., 1975, “A Hydrostatic Model for Solder Fillets,” Western Electric Engineer, Vol. 19, No. 2, pp. 31-42.
2. Heinrich, S.M., 1994, “Prediction of Solder Joint Geometry,” chap. 5, Mechanics of Solder Alloy Interconnects, Frear et al., eds., Van Nostrand Reinhold, pp. 158-198.
3. Hsu, T. F., 1996, “Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint,” MS thesis, Marquette University, Milwaukee, WI.
4. Klein Wassink, R. J., 1989, Soldering in Electronics, 2nd ed., Electrochemical Publications Limited, pp. 51-54.
5. Ramasubramanian, N., 1994, “Study of Axisymmetric Solder Joints used in Electronic Packaging,” MS thesis, Marquette University, Milwaukee, WI.
6. Rooks, S., Racz, L. M., Szekaly, J., Benhabib, B., Neumann, A. W., 1991, “Evaluation of Two-Dimensional and Three-Dimensional Axisymmetric Fluid Interface Shapes with Boundary Conditions,” Langmuir, Vol. 7, No. 12, pp. 3222-3228