Combined heat transfer and thermal stress analysis for fatigue life prediction of solder joints of resistors

TMS Annual Meeting

Volumn , Issue , 1997, Pages 187-195

  Akay, H U ^a   Bilgic, A ^a   Zhang, H ^a   Paydar, N H ^a  

^a INDIANA UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; HEAT TRANSFER; RESISTORS; STRAIN; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION; THERMAL STRESS; THERMOANALYSIS; THERMOCOUPLES;

POWER LOADING CYCLES;

SOLDERED JOINTS;

EID: 0031383666     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)