Combination of focused ion beam (FIB) and transmission electron microscopy (TEM) as sub-0.25 μm defect characterization tool

Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1997, Pages 80-85

  Doong, Yih Yuh ^a   Fu, Jui Mei ^a   Hsieh, Yong Fen ^a  

^a Continental Engineering Consultants Inc ^*

Author keywords

[No Author keywords available]

Indexed keywords

INSPECTION EQUIPMENT; ION BEAMS; OPTICAL MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

FOCUSED ION BEAMS (FIB);

INTEGRATED CIRCUIT TESTING;

EID: 0031383038     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)