Heel cracking induced by the steep conversion of EMC in large QFP

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 201-204

  Lee, Y M ^a   Cho, J H ^a   Sun, Y B ^a   Kim, N S ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; CRACK INITIATION; ELECTROMAGNETIC COMPATIBILITY; FAILURE ANALYSIS; FRACTURE MECHANICS; OPTIMIZATION; POLYMERIZATION; SHRINKAGE; TRANSFER MOLDING;

HEEL CRACK RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0031382813     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)