Evaluation of defect detection schemes for CMP process monitoring using rigorous 3-D EM simulations

IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop

Volumn , Issue , 1997, Pages 283-288

  Swecker, Aaron L ^a   Strojwas, Andrzej J ^a   Levy, Ady ^a   Bell, Bobby ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; INSPECTION; LIGHTING; MATHEMATICAL MODELS; MAXWELL EQUATIONS; MONITORING; THREE DIMENSIONAL;

CHEMICAL MECHANICAL POLISHING; DEFECT DETECTION; ULTRA BROAD BAND;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031382349     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)