Preparation of tin disulphide thin films by solution growth

International Journal of Materials and Product Technology

Volumn 12, Issue 4-6, 1997, Pages 490-495

  Varkey, A J ^a  

^a UNIVERSITY OF SWAZILAND   (Swaziland)

Author keywords

Solution growth; Thin film; Tin disulphide

Indexed keywords

DEPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; ENERGY GAP; FILM GROWTH; FILM PREPARATION; OPTICAL PROPERTIES; SOLUTIONS; TIN COMPOUNDS;

SOLUTION GROWTH; TIN DISULFIDE;

THIN FILMS;

EID: 0031380324     PISSN: 02681900     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

1. Upadhyay H.M. and Chandra, S. (1994) J. Mater.Sc., vol. 29, no. 10, 2734.
2. Sebastian, P.J. (1994) Adv. Mater. for Optics & Electronics, vol. 4, no. 6, p. 407.
3. Grozanov, I. (1994) Mater. Lett., vol. 19, no.5-6, p. 281.
4. Estrada, C.A., Nair, P.K., Nair, M.T.S., Zingaro, R.A. and Myers, E.A. (1994) J.Electrochem.Soc. (USA), vol. 141, no. 3,p. 882.
5. Dona, J.M. and Herroro, J. (1994) J.Electrochem.Soc., vol. 141, no. 1, p. 205.
6. Desai, J.D., Lokhande, C.D (1994) Thin Solid Films, Vol. 249, no. 2, p. 135.
7. Varkey, A.J. and Fort, A.F. (1993) J. Solar Energy Mater., Vol. 29, p. 253.
8. Ocampo, M., Sebastian, P.J. and Campos, J. (1994) Phys. Status Solidi, (a), vol. 143, no.1, K29.
9. Vidhyadharan Pillai, P.K. and Vilayakumar, K.P. (1995) J. Mater. Sc. Lett., vol. 13, no. 23, p. 1725.
10. Varkey, A.J. and Fort, A.F. (1994) J. Thin Solid Films,vol 23, p. 211.
11. Varkey, A.J. and Fort, A.F. (1993) Thin Solid Films, Vol. 235, p. 47.
12. Kunnoudi, S., Nakazawa, T., Ashida, A. and Yamamoto, N. (1994) J. Solar Energy Mater. & Solar Cells, Vol. 35, no. 1-4, p. 185.
13. Varkey, A.J. and Fort, A.F. (1993) J. Solar Energy Mater., Vol. 31, p. 277.
14. Whitehouse C.R. and Balchin, A.A. (1979) J. Mater. Sci., Vol. 144, p. 2516.
15. Lokhande, C.D. (1990) J. Physics D Appl. Physics, vol. 23, no. 12, p. 1703.
16. Amir, O., Lifshitz, E., Rider, V., Uzan-Saguy, C. and Kalish, R. (1992) J. Appl. Phys. Lett., vol. 60, no. 26, p. 3241.