Effects of device variations on the EMI potential of high speed digital integrated circuits

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 1997, Pages 208-212

  DiBene II, Joseph T ^a   Knighten, James L ^a  

^a NCR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; DIGITAL INTEGRATED CIRCUITS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; HARMONIC ANALYSIS; PRINTED CIRCUIT BOARDS; WAVEFORM ANALYSIS;

TAPE BALL GRID ARRAY (TGBA) PACKAGES;

ELECTROMAGNETIC WAVE EMISSION;

EID: 0031379925     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)