Diamond wafer for SAW application

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 1997, Pages 183-186

  Fujii, S ^a   Seki, Y ^a   Yoshida, K ^a   Nakahata, H ^a   Higaki, K ^a   Kitabayashi, H ^a   Shikata, S ^a  

^a SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING DIAMONDS; SILICON WAFERS;

DIAMOND WAFERS;

ACOUSTIC SURFACE WAVE DEVICES;

EID: 0031379331     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)