Post-route optimization for improved yield using a rubber-band wiring model

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers

Volumn , Issue , 1997, Pages 700-706

  Su, Jeffrey Z ^a   Dai, Wayne W ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; OPTIMIZATION;

RUBBER BAND WIRING MODEL;

MICROPROCESSOR CHIPS;

EID: 0031378509     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iccad.1997.643615     Document Type: Conference Paper

References (13)