Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 91-94

  Yun, Sang Ki ^a   Lee, Hai Young ^a  

^a Ajou University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SOFTWARE; CROSSTALK; ESTIMATION; FAST FOURIER TRANSFORMS; RADIATION EFFECTS;

BONDWIRES; SOFTWARE PACKAGE SPICE;

ELECTRONICS PACKAGING;

EID: 0031378457     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)