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Volumn , Issue , 1997, Pages 184-191
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Test chip development to support standardization efforts
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Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITORS;
DIES;
ENVIRONMENTAL TESTING;
INTEGRATED CIRCUIT MANUFACTURE;
INTEGRATED CIRCUIT TESTING;
MOISTURE DETERMINATION;
RELIABILITY;
RESISTORS;
SENSORS;
STANDARDIZATION;
STRAIN GAGES;
RELIABILITY TESTING;
STRAIN GAGE ROSETTES;
ELECTRONICS PACKAGING;
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EID: 0031377810
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (10)
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